COMPANY PROFILE

Omega Micro Technologies, Inc., located in the Ross Enterprise Center in West Lafayette, Indiana, was founded with the goal of providing complete, full-service design and prototype fabrication through volume production to our customers. Omega is actively involved in the design and fabrication of products for military, commercial and automotive customers.

MISSION

Omega’s mission is to deliver defect-free product which meets or exceeds customers’ requirements and deliver on time at competitive prices. In order to meet this goal, Omega is committed to training and empowering all employees and by continually monitoring and improving performance.

Omega is ITAR registered and working towards ISO certification by mid 2015.

CORE COMPETENCIES

Omega's design engineers are experts in the modeling, simulation, and design of RF, microwave, and analog circuitry from DC to 40 GHz. Additionally, Omega has the capability to perform characterization testing of developed circuitry up to 8.5 GHz in-house, and up to 110 GHz through a working relationship with Purdue University.

Omega’s process engineers are experts in material selection, advanced fabrication and processing techniques, packaging, assembly and testing. Omega has the capacity in-house to support prototype through volume production.

Key Omega technological capabilities that lend flexibility to an end-customer’s application include:

  • High frequency substrates and packages operating at frequencies up to 110 GHz.
  • Fully hermetic high reliability packaging.
  • Space and flight qualified substrates and packages.
  • Ability to design and fabricate with multiple commercially available materials sets from vendors such as DuPont, Ferro, and Heraeus and using various conductor systems such gold, silver, mixed metal, and nickel-gold plated silver.
  • Plateable Silver Process: Omega’s proprietary electro-less plating process utilizes a Nickel barrier over all exposed external silver followed by a immersion gold flash and then an optional electroless gold (when applicable for wire-bonding and brazing). The plating process provides substrates with reliability approaching that of an all-gold substrate, but at nearly the price of an all-silver substrate.
  • Development and initial prototypes of enhanced thermal conductivity heat spreaders.
  • Multi-Layer Cavities: Cavity formation creates multi-layered structures with a reduced profile for stacking; allows the use of shorter wire bonds; and allows for making flat surface-mountable packages.
  • Complex 3-Dimensional Shapes: Novel shapes utilizing LTCC for custom applications.
  • Package on Package (PoP): The PoP approach creates multiple faces for surface mounting of IC’s and passive components while allowing internal routing as well as embedded passives for the ultimate in high density applications.
  • Omega Micro Technologies, Inc.
  • 3495 Kent Avenue - Ste M100
  • West Lafayette, IN 47906
  • P: 765.775.1011
  • F: 765.463.4106
  • E: info@omegamicrotech.com
  • Omega Micro Technologies, Inc., located in the Ross Enterprise Center in West Lafayette, Indiana, was founded with the goal of providing complete, full-service design and fabrication solutions to our customers.